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Applied Sciences
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Advances in MEMS Sensors
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Advances in MEMS Sensors

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".

Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 2059

Special Issue Editors

Prof. Chia-Yen John Lee

E-Mail Website
Guest Editor
Institute of Materials Engineering, National Pingtung University of Science and Technology, Pingtung 912, Taiwan
Interests: MEMS; microfabrication technologies; micro sensors; microsystems
Prof. Wen-Cheng Kuo

E-Mail Website
Guest Editor
Department of Mechatronics Engineering, National Kaohsiung University of Science and Technology, Kaohsiung 811, Taiwan
Interests: MEMS; implantable biomedical device; design and fabrication of micro/nano structures

Special Issue Information

Dear Colleagues,

Recent advances in MEMS (microelectromechanical systems) sensor technologies have played important roles in many fields. Individual or integrated sensors and their networks have enabled the efficient use of information and resources while facilitating the realization of harsh and dangerous tasks in different fields. Methods and protocols designed for operable and profitable devices have also driven the processing of relevant information-oriented sensor technologies (chemical and physical sensors) towards greater efficiency. The MEMS research community has devoted great efforts to advancing the state-of-the-art sensor technologies by improving microfabrication processes and microsystem designs. In this Special Issue, research considering recent advances in MEMS sensors will be highlighted.

Prof. Chia-Yen John Lee
Prof. Wen-Cheng Kuo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microelectromechanical systems (MEMS)
  • chemical sensors
  • physical sensors
  • micro- and nanotechnologies

Published Papers (1 paper)

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Research

12 pages, 4335 KiB  
Article
Effect of Substrate-Thickness on Voltage Responsivity of MEMS-Based ZnO Pyroelectric Infrared Sensors
by Chia-Yen Lee, Cheng-Xue Yu, Kuan-Yu Lin and Lung-Ming Fu
Appl. Sci. 2021, 11(19), 9074; https://0-doi-org.brum.beds.ac.uk/10.3390/app11199074 - 29 Sep 2021
Cited by 3 | Viewed by 1637
Abstract
Pyroelectric infrared sensors incorporating suspended zinc oxide (ZnO) pyroelectric films and thermally insulated silicon substrates are fabricated using conventional MEMS-based thin-film deposition, photolithography, and etching techniques. The responsivity of the pyroelectric films is improved through annealing at a temperature of 500 °C for [...] Read more.
Pyroelectric infrared sensors incorporating suspended zinc oxide (ZnO) pyroelectric films and thermally insulated silicon substrates are fabricated using conventional MEMS-based thin-film deposition, photolithography, and etching techniques. The responsivity of the pyroelectric films is improved through annealing at a temperature of 500 °C for 4 h. The temperature variation and voltage responsivity of the fabricated sensors are evaluated numerically and experimentally for substrate thickness in the range of 1 to 500 μm. The results show that the temperature variation and voltage responsivity both increase with a reducing substrate thickness. For the lowest film thickness of 1 μm, the sensor achieves a voltage sensitivity of 3880 mV/mW at a cutoff frequency of 400 Hz. In general, the results presented in this study provide a useful source of reference for the further development of MEMS-based pyroelectric infrared sensors. Full article
(This article belongs to the Special Issue Advances in MEMS Sensors)
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