Advancements in Micro and Nanoelectromechanical Devices
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".
Deadline for manuscript submissions: closed (15 January 2022) | Viewed by 2085
Special Issue Editors
Interests: MEMS/NEMS; RF circuits; nonlinear dynamics
Special Issue Information
Dear Colleagues,
In the last few decades, micro- and nanoelectromechanical systems (MEMS/NEMS) research has advanced at an unprecedented pace, impacting a variety of disciplines, spanning from communication and sensing to computing and medicine. As a result, several MEMS/NEMS devices have become commercially available and today play a fundamental role in many existing integrated systems thanks to their ability to meet critical and heterogeneous needs that cannot be addressed by other miniaturized technologies. Lately, even more advanced MEMS/NEMS devices have been reported, defining new technological paradigms in the traditional fields of application and opening new possibilities in incipient fields such as the Internet of Things (IoT), quantum computing and sensing, and autonomous vehicles. Such impressive progress in the development of MEMS/NEMS devices has been driven by a continuous understanding of their underlying physics and their device operation, as well as by a strong advancement in finite element (FE) modeling and microfabrication techniques.
The aim of this Special Issue is to present the most advanced research, the latest achievements, and the technological developments of MEMS/NEMS and their applications in topics including (but not limited to) the following:
- 5G communication;
- Internet of Things (IoT) and embedded systems;
- Quantum communication and sensing;
- Optics and optomechanics;
- Frequency generation, stability, and noise;
- Ultrasound imaging;
- Nonlinear dynamics;
- Finite element modeling;
- Sensing in harsh environments;
- Energy harvesting;
- Advanced computing beyond von Neumann;
- Medical and wearable devices;
- Power MEMS;
- Microfluidics;
- Advancements in packaging and microfabrication;
- Novel materials and physics;
- Optical MEMS by microrobotics.
Dr. Cristian Cassella
Dr. Jeronimo Segovia Fernandez
Guest Editors
Manuscript Submission Information
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