Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
4.5
2.7
Journals
Applied Sciences
Special Issues
Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond
share announcement

Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Optics and Lasers".

Deadline for manuscript submissions: closed (31 December 2020) | Viewed by 17626

Special Issue Editors

Dr. Peicheng Liao

E-Mail Website1 Website2
Guest Editor
Intel Corporation, Santa Clara, CA 95054, USA
Interests: optical communication and interconnect; optical signal processing; integrated photonics; nonlinear optics
Dr. Changjing Bao

E-Mail Website
Guest Editor
Nokia Corporation, Murray Hill, NJ 07974, USA
Interests: optical communication system; optical interconnect; integrated optics; nonlinear optics
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Yang Yue

E-Mail Website
Guest Editor
School of Information and Communications Engineering, Xi'an Jiaotong University, Xi'an 710049, China
Interests: intelligent photonics; optical communications; optical perception; optical chip
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Zhongqi Pan

E-Mail Website
Guest Editor
Dept. of Electrical and Computer Engineering, Bell South Mobility/LEQSF Regents Endowed Professor in Telecommunications; Harold Callais/BORSF Endowed Professor in Electrical Engineering II, University of Louisiana at Lafayette, Lafayette, LA 70504-3890, USA
Interests: optical communications and networking; digital signal processing; optical sensing
Special Issues, Collections and Topics in MDPI journals
Prof. Odile Liboiron-Ladouceur

E-Mail Website
Guest Editor
Department of Electrical & Computer Engineering, McConnell Engineering Building, 3480 University Street, Room 633, Montreal, QC H3A 0E9, Canada
Interests: component development for data communications; photonics integrated circuits; optical subsystems; high-speed interconnects

Special Issue Information

Dear Colleagues,

In the past decades, photonic integration has shown its potenial to miniaturize the optical systems with improved performance at a lower cost. A large number of functional devices have been developed on chip exploiting the CMOS-compatible silicon photonics platform or other variants such as InP and SiN materials. This implementation is promising in enhancing the functionality of photonical circuits with higher reliablity, which is eagerly desirable for various optical applications. As an example, high bandwidth devices and high throughput systems on the chip have been demonstrated with significant improvement for the energy efficiency data communications. Meanwhile, such technology development and advances have enabled a myriad of other applications including sensing, microwave photonics and data center interconnections. This Special Issue focuses on the state-of-the-art research exploiting the integrated photonics technology for advanced optical systems and novel applications. It will cover a variety of photonic integration related topics including biomedical systems, remote sensing, telecommunications, and on-chip interconnection, etc.

Dr. Peicheng Liao
Dr. Changjing Bao
Dr. Yang Yue
Prof. Zhongqi Pan
Prof. Odile Liboiron-Ladouceur
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Photonic integrated circuits
  • Silicon photonics
  • Integrated devices
  • Hybrid integration
  • Optical waveguides
  • Fiber grating couplers
  • Microresonatorss
  • Data communications
  • Coherent communications
  • Optical interconnect
  • System on chip
  • Optical Subsystems
  • RF- and microwave-related photonic integration
  • Fiber optic sensing
  • LiDAR

Published Papers (4 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

Jump to: Review

14 pages, 1297 KiB  
Article
X-Band Photonic-Based Pulsed Radar Architecture with a High Range Resolution
by Youngseok Bae, Minwoo Yi, Jinwoo Shin and Sang-Gug Lee
Appl. Sci. 2020, 10(18), 6558; https://0-doi-org.brum.beds.ac.uk/10.3390/app10186558 - 20 Sep 2020
Cited by 10 | Viewed by 2819
Abstract
In this paper, we propose an X-band photonic-based pulsed radar architecture with a high range resolution. The proposed architecture is operated as a pulsed radar by adding a Mach-Zehnder modulator (MZM) operating as an optical switch to a transmitter of a conventional [...] Read more.
In this paper, we propose an X-band photonic-based pulsed radar architecture with a high range resolution. The proposed architecture is operated as a pulsed radar by adding a Mach-Zehnder modulator (MZM) operating as an optical switch to a transmitter of a conventional photonic-based frequency-modulated continuous wave (FMCW) radar. In addition, a balanced photodetector (BPD) is employed to enhance the amplitude of the received signal and remove common-mode noise. A proposed photonic-based pulsed radar prototype is implemented to operate at a center frequency of 10 GHz, a bandwidth of 640 MHz, and a pulse repetition frequency (PRF) of 1 kHz considering the performances of an arbitrary waveform generator (AWG). The implemented prototype is verified through an indoor experiment. As a result, the positions of targets are detected in real-time with 1.6% error rates of a range accuracy and obtained the range resolution of 0.26 m. Full article
(This article belongs to the Special Issue Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond)
►▼ Show Figures

Figure 1

13 pages, 2637 KiB  
Article
A Compact High-Efficient Equivalent Circuit Model of Multi-Quantum-Well Vertical-Cavity Surface-Emitting Lasers for High-Speed Interconnects
by Shanglin Li, Mohammadreza Sanadgol Nezami, David Rolston and Odile Liboiron-Ladouceur
Appl. Sci. 2020, 10(11), 3865; https://0-doi-org.brum.beds.ac.uk/10.3390/app10113865 - 02 Jun 2020
Cited by 6 | Viewed by 3396
Abstract
Due to their low power consumption, high modulation speed, and low cost, vertical-cavity surface-emitting lasers (VCSEL) dominate short-reach data communications as the light source. In this paper, we propose a compact equivalent circuit model with noise effects for high-speed multi-quantum-well (MQW) VCSELs. The [...] Read more.
Due to their low power consumption, high modulation speed, and low cost, vertical-cavity surface-emitting lasers (VCSEL) dominate short-reach data communications as the light source. In this paper, we propose a compact equivalent circuit model with noise effects for high-speed multi-quantum-well (MQW) VCSELs. The model comprehensively accounts for the carrier and photons dynamisms of a MQW structure, which includes separate confinement heterostructure (SCH) layers, barrier (B) layers, and quantum well (QW) layers. The proposed model is generalized to various VCSEL designs and accommodates a flexible number of quantum wells. Experimental validation of the model is performed at 25 Gb/s with a self-wire-bonded 850 nm VCSEL. Full article
(This article belongs to the Special Issue Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond)
►▼ Show Figures

Figure 1

Review

Jump to: Research

22 pages, 5014 KiB  
Review
The Opto-Electronic Functional Devices Based on Three-Dimensional Lead Halide Perovskites
by Henan Liu, Hao Zhang, Xunling Xu and Lin Zhang
Appl. Sci. 2021, 11(4), 1453; https://0-doi-org.brum.beds.ac.uk/10.3390/app11041453 - 05 Feb 2021
Cited by 11 | Viewed by 2897
Abstract
These days, opto-electronic functional devices based on three-dimensional lead halide perovskites (LHPs) are emerging. LHPs could be spin-coated to other materials, making it very convenient to combine LHPs with different categories of materials including metals, semiconductors, and polymers and achieve high-level performances. In [...] Read more.
These days, opto-electronic functional devices based on three-dimensional lead halide perovskites (LHPs) are emerging. LHPs could be spin-coated to other materials, making it very convenient to combine LHPs with different categories of materials including metals, semiconductors, and polymers and achieve high-level performances. In this review, we will discuss the development in the LHP-based functional devices in recent years. After a brief presentation of the LHP’s properties, we will focus on the functional devices including lasers, photodetectors, and modulators. Then the fabrication of the LHP-based devices will be presented, which is followed by the summary and outlook. Full article
(This article belongs to the Special Issue Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond)
►▼ Show Figures

Figure 1

37 pages, 8398 KiB  
Review
Silicon Integrated Nanophotonic Devices for On-Chip Multi-Mode Interconnects
by Hongnan Xu, Daoxin Dai and Yaocheng Shi
Appl. Sci. 2020, 10(18), 6365; https://0-doi-org.brum.beds.ac.uk/10.3390/app10186365 - 12 Sep 2020
Cited by 41 | Viewed by 7757
Abstract
Mode-division multiplexing (MDM) technology has drawn tremendous attention for its ability to expand the link capacity within a single-wavelength carrier, paving the way for large-scale on-chip data communications. In the MDM system, the signals are carried by a series of higher-order modes in [...] Read more.
Mode-division multiplexing (MDM) technology has drawn tremendous attention for its ability to expand the link capacity within a single-wavelength carrier, paving the way for large-scale on-chip data communications. In the MDM system, the signals are carried by a series of higher-order modes in a multi-mode bus waveguide. Hence, it is essential to develop on-chip mode-handling devices. Silicon-on-insulator (SOI) has been considered as a promising platform to realize MDM since it provides an ultra-high-index contrast and mature fabrication processes. In this paper, we review the recent progresses on silicon integrated nanophotonic devices for MDM applications. We firstly discuss the working principles and device configurations of mode (de)multiplexers. In the second section, we summarize the multi-mode routing devices, including multi-mode bends, multi-mode crossings and multi-mode splitters. The inverse-designed multi-mode devices are then discussed in the third section. We also provide a discussion about the emerging reconfigurable MDM devices in the fourth section. Finally, we offer our outlook of the development prospects for on-chip multi-mode photonics. Full article
(This article belongs to the Special Issue Integrated Photonics 2020: Sensing, Communication, Interconnection and Beyond)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-4
Back to TopTop